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Articles (27)
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1

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Yew, Ming-Chih, Yang, Wen-Kun, Chiang, Kuo-Ning

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2008

2

Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

Hung, Tuan-Yu, Liao, Li-Ling, Wang, C. C., Chi, W. H., Chiang, Kuo-Ning

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 2.04 MB

english, 2014

3

Double relay lens for a microscopic observation system

Journal:

Optical Engineering

Année:

1992

Langue:

english

Fichier:

PDF, 359 KB

english, 1992

4

Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period

Hung, Tuan-Yu, Huang, Chao-Jen, Lee, Chang-Chun, Wang, Chin-Chun, Lu, Keng-Cheng, Chiang, Kuo-Ning

Journal:

Microelectronic Engineering

Année:

2013

Langue:

english

Fichier:

PDF, 1012 KB

english, 2013

5

Light degradation test and design of thermal performance for high-power light-emitting diodes

Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang

Journal:

Microelectronics Reliability

Année:

2012

Langue:

english

Fichier:

PDF, 2.02 MB

english, 2012

6

High-Performance and Low-Cost 10-Gb/s Bidirectional Optical Subassembly Modules

Tien-Tsorng Shih, Min-Ching Lin, Pei-Hao Tseng, Chang-You Li, Tuan-Yu Hung, Yi-Jen Chiu, Wood-Hi Cheng

Journal:

Journal of Lightwave Technology

Année:

2007

Langue:

english

Fichier:

PDF, 610 KB

english, 2007

7

Development of Empirical Equations for Metal Trace Failure Prediction of Wafer Level Package Under Board Level Drop Test

Chan-Yen Chou, Tuan-Yu Hung, Chao-Jen Huang, Kuo-Ning Chiang

Journal:

IEEE Transactions on Advanced Packaging

Année:

2010

Langue:

english

Fichier:

PDF, 1.35 MB

english, 2010

8

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Investigation of Influences of PCB on Board-level Drop Test by Dynamic Simulation and Modal Analysis

Chou, Chan-Yen, Hung, Tuan-Yu, Sano, Masafumi, Yang, Shin-Yueh, Chiang, Kuo-Ning

Année:

2008

Langue:

english

Fichier:

PDF, 4.08 MB

english, 2008

9

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and explicit time integration methods

Lin, Kuan-Chung, Tsai, Chia-Chi, Su, Yen-Fu, Hung, Tuan-Yu, Chiang, Kuo-Ning

Année:

2013

Langue:

english

Fichier:

PDF, 821 KB

english, 2013

10

Fused-silica focusing lens for deep UV laser processing

Hung, Tuan-Yu, Su, Ching-Shen

Journal:

Année:

1992

Langue:

english

Fichier:

PDF, 2.37 MB

english, 1992

11

Electro-thermal finite element analysis and verification of power module with aluminum wire

Liao, Li-Ling, Hung, Tuan-Yu, Liu, Chun-Kai, Li, Wei, Dai, Ming-Ji, Chiang, Kuo-Ning

Journal:

Microelectronic Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 2.50 MB

english, 2014

12

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Study on configuration design of interconnection in high power module

Liao, Li-Ling, Hung, Tuan-Yu, Liu, Chun-Kai, Yen-Fu Su,, Chiang, Kuo-Ning

Année:

2014

Langue:

english

Fichier:

PDF, 839 KB

english, 2014

13

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Electro-thermal analysis of the Insulated Gate Bipolar Transistor module subjected to power cycling test using specified boundary condition technology

Shih-Ying Chiang,, Hung, Tuan-Yu, Hsien-Chih Ou,, Kuo-Ning Chiang,

Année:

2011

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2011

14

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Investigating the temperature effect of reliability on integration IC 3D packaging under drop test

Chen, Hao-Chih, Chiang, Yi-Che, Hung, Tuan-Yu, Chiang, Kuo-Ning

Année:

2013

Langue:

english

Fichier:

PDF, 311 KB

english, 2013

15

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal design and transient analysis of insulated gate bipolar transistors of power module

Hung, Tuan-Yu, Chiang, Shih-Ying, Chou, Chan-Yen, Chiu, Chien-Chia, Chiang, Kuo-Ning

Année:

2010

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2010

16

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bonding wire life prediction model of the power module under power cycling test

Tuan-Yu Hung,, Chin-Chun Wang,, Kuo-Ning Chiang,

Année:

2013

Langue:

english

Fichier:

PDF, 1.79 MB

english, 2013

17

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Reliability analysis of 3D IC integration packaging under drop test condition

Yen-Ju Lee,, Yen-Fu Su,, Tuan-Yu Hung,, Kuo-Ning Chiang,

Année:

2012

Langue:

english

Fichier:

PDF, 966 KB

english, 2012

18

Laser microprobe and resonance ionization mass spectrometry for the analysis of trace elements in solids

Hung, Tuan-Yu, Su, Ching-Shen

Journal:

Review of Scientific Instruments

Année:

1992

Langue:

english

Fichier:

PDF, 1.16 MB

english, 1992

19

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Investigation of stress-buffer-enhanced package subjected to board-level drop test

Chan-Yen Chou,, Tuan-Yu Hung,, Ming-Chih Yew,, Wen-Kun Yang,, Dyi-Chung Hu,, Mon-Chin Tsai,, Ching-Shun Huang,, Kuo-Ning Chiang,

Année:

2008

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2008

20

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test

Masafumi Sano,, Chou, Chan-Yen, Hung, Tuan-Yu, Shin-Yueh Yang,, Kuo-Ning Chiang,

Année:

2009

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2009

21

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Reliability and parametric study on chip scale package under board-level drop test

Masafumi Sano,, Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Chao-Jen Huang,, Chiang, Kuo-Ning

Année:

2009

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2009

22

[IEEE 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Tokyo, Japan (2010.08.24-2010.08.26)] 2010 IEEE CPMT Symposium Japan - A study on the thermal performance of a chip-in-substrate-type LED package structure

Su, Yen-Fu, Hung, Tuan-Yu, Yang, Shin-Yueh, Chiang, Kuo-Ning

Année:

2010

Langue:

english

Fichier:

PDF, 723 KB

english, 2010

23

[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Reliability Assessment of 3D Chip Stacking Package Using Metal Bonding and Through Silicon Via Technologies

Syu, Shih-Yi, Hung, Tuan-Yu, Huang, Chao-Jen, Wang, Han-Jung, Lee, Hsin-Li, Chiang, Kuo-Ning

Année:

2010

Langue:

english

Fichier:

PDF, 1004 KB

english, 2010

24

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Reliability analysis of copper bump interconnection in double-sided power module

Chia-Chi Tsai,, Li-Ling Liao,, Yen-Fu Su,, Hung, Tuan-Yu, Chiang, Kuo-Ning

Année:

2015

Fichier:

PDF, 748 KB

2015

25

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Reliability analysis of copper bump interconnection in double-sided power module

Chia-Chi Tsai,, Li-Ling Liao,, Yen-Fu Su,, Hung, Tuan-Yu, Chiang, Kuo-Ning

Année:

2015

Langue:

english

Fichier:

PDF, 748 KB

english, 2015

26

SPIE Proceedings [SPIE Integrated Optoelectronic Devices 2007 - San Jose, CA (Saturday 20 January 2007)] Photonics Packaging, Integration, and Interconnects VII - 10 Gb/s bidirectional optical subassembly module for the application of FTTH network

Shih, Tien-Tsorng, Earman, Allen M., Chen, Ray T., Lin, Min-Ching, Tseng, Pei-Hau, Chiu, Yi-Jen, Li, Chang-You, Hung, Tuan-Yu, Cheng, Wood-Hi

Année:

2007

Langue:

english

Fichier:

PDF, 373 KB

english, 2007

27

SPIE Proceedings [SPIE International Conference on Experimental Mechnics 2008 and Seventh Asian Conference on Experimental Mechanics - Nanjing, China (Saturday 8 November 2008)] ICEM 2008: International Conference on Experimental Mechanics 2008 - Validation and reliability assessment of board level drop test of chip-scale-packaging

Hung, Tuan-Yu, He, Xiaoyuan, Xie, Huimin, Chou, Chan-Yen, Yew, Ming-Chih, Kang, YiLan, Chiang, Kuo-Ning

Année:

2008

Langue:

english

Fichier:

PDF, 862 KB

english, 2008